Embedded System & Circuit Design Engineer Fresher Jobs In Kolkata, TENPI Technologies Pvt Ltd
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TENPI Technologies Pvt Ltd

Embedded System & Circuit Design Engineer

TENPI Technologies Pvt Ltd

0 - 0 Years   |   2.16 - 3 LPA   |   Kolkata
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Job Description

About The Company:-  TENPi Technologies Private Limited is an Internet of Things (IoT) enabled product based start-up company based in Kolkata, India. They are being incubated and supported by NASSCOM 10000 Start-up Warehouse, Kolkata and Start Up India program. We work with a mission to incorporate technology in our day to day life. That is why we at TENPi are coming up with innovative solutions to products that are very useful and yet technologically backdated. At first we are building IoT enabled wallets, Handbags, files/folders, backpacks & trolleys. Our expectations for faster, smoother, more humanly intuitive innovations has kick-started a revolutionary change in the way businesses operate. Keeping this in mind, we at TENPi Technologies are committed to develop next generation smart devices.

Website: http://www.tenpitech.com/

Salary: Stipend during intenrship period INR 3000- INR 6000 per month ( 4-5 months)
          Post Internship INR 2.16 LPA - INR 3 LPA (permanent employment will be purely on performance basis)
           
Target Batch Passouts: 2015-2016

Course Specialization: B.E/B.Tech (ECE/EEE)

Job Location: Kolkata    

Desired Experience: Fresher

Tentative Date Of Interview: Will be communicated post registration window is closed.

Tentative Date Of Joining: Immediate

* The shortlisted candidates will be sent Admit Cards/Call Letters on their registered mail Id, which they will need to, carry on the date of Interview. No candidate will be entertained by the company without the formal intimation from Aspiring Minds.

Job Description and Skill Set Required:-.
- Candidate should have good knowledge in the following domains:-
- Embedded System.
- Circuit Designing.
- microprocessors.
- microcontrollers.
- PCB designing.
- Programming/coding.
- Firmware, wireless communication.

Interview Process:
- Technical Round(Written)
- HR Round(Face to Face)

Last Date To Apply: 16 January 2017


Education:

B.Tech/B.E.

Work Experience:

0 - 0 Years

Salary

2.16 - 3 LPA

Industry

Electronics & Semiconductor

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